Leak Suggests Snapdragon 8 Gen 4 and Dimensity 9400 Will Be Manufactured on 3nm Designs

[Yash Phulfagar]

Qualcomm and MediaTek, the two dominant players in the smartphone chipset industry, are gearing up to release their next-generation flagship chipsets—Qualcomm Snapdragon 8 Gen 4 and MediaTek Dimensity 9400. A new leak has surfaced, giving us a sneak peek into the potential performance of these upcoming chips. Let’s dive in.

 

According to the Chinese tipster Digital Chat Station on Weibo, the Snapdragon 8 Gen 4 is expected to be manufactured on TSMC's 3nm process. The chipset is rumored to feature an octa-core CPU with two “Phoenix L” cores clocked at 4.32GHz and six “Phoenix M” cores running at 3.53GHz.

 

On the other hand, the Dimensity 9400 is said to include an octa-core CPU comprising one Cortex-X5 core at 3.63GHz, three Cortex-X4 cores at 2.8GHz, and four Cortex-A7xx cores running at 2.1GHz. This chipset will reportedly be paired with an Arm Immortalis G925 MC12 GPU for advanced graphics capabilities.

 

Both Qualcomm and MediaTek’s upcoming chipsets are anticipated to deliver improvements in battery efficiency and significant sustained performance gains over the previous generation. Smartphones equipped with these chipsets are expected to debut as soon as October this year.

 

Edited September 16 by Yash Phulfagar